Introduction to the application of YONGS industrial computer IPC-820 in the LED die bonding machine system
1. Project setting: With the increasingly severe smog pollution in various places around the world, all kinds of pollution, global weather warming and other aggravating discoveries, a new round of environmental protection and energy saving has been launched in the world. Emission reduction should be regarded as a type of failure with strong support. Various failures of energy saving and emission reduction are mainly to respond to the insidious environment of weather changes. my country has put forward the index requirements of reducing energy consumption per unit of GDP and reducing pollution emissions.
In view of the above problems, my country will not allow the market sale of incandescent lamps of various wattages in 2016, which provides a huge environmental trend opportunity for the new LED implementation and widespread use. With the development of the LED industry, the demand for LED manufacturing structures is getting higher and higher, and the demand for semiconductor structures such as die bonders is increasing. At the same time, the rapid development of YONGS IPC technology is sufficient to meet the needs. Guarantees are provided. The YONGS IPC-820 industrial computer has a highly reliable and more stable special computer. It is widely used in the control, processing and machine vision of LED die bonders. , speed, human-computer interaction and other aspects are doubled.
The midstream packaging technology (die bonder, wire bonder, glue dispenser, etc.) of the LED industry chain is basically controlled by companies in mainland China and Taiwan, reducing manpower, improving product equality, improving product quality, and more suitable for a large number of Quantitative manufacturing, reducing manufacturing cost, and improving manufacturing efficiency have become the indicators that these companies seek, and the automated manufacturing structure provides effective guarantees for these companies to improve manufacturing efficiency, reduce cost, and improve the equivalence of products, so as to ensure effective progress. In order to improve the competitiveness of enterprises, especially to improve product accuracy, without the use of automated manufacturing, the foundation cannot meet manufacturing needs.
Two system requests
The LED die bonding machine is an automatic structure that absorbs the LED chips from the wafer tray and mounts them on the PCB (printed clear board) to complete the automatic bonding of the LED chips and the inspection of defective chips. It can be seen that most of the LED manufacturing lines It is suitable for the manufacture of various high-quality, high-brightness LEDs (red, green, white, yellow, etc.), and can be fully suitable for the manufacture of three-tube, semiconductor discrete devices, DIP and SOP and other products. It is suitable for wide range and versatility powerful.
The system layout of the LED die bonding machine mainly includes the action control module, the pneumatic part, the machine vision part and the action execution mechanism module, through the data communication between the PCI bus interface and the special computer control center.
Working principle: The feeding mechanism transfers the PCB board to the working position on the working table fixture. First, the dispensing mechanism dispenses glue to the position where the PCB needs to be bonded to the chip, and then the bonding arm moves from the origin position to the absorption chip position. The wafer is arranged on the film-supported expander wafer tray. After the bonding arm is in place, the suction nozzle moves downward, and the ejector moves upward to lift the wafer. After picking up the wafer, the bonding arm returns to the original position (leakage inspection position), and the bonding arm Then move from the origin position to the bonding position. After the nozzle is down to bond the wafer, the bonding arm returns to the origin position again, which is a complete bonding process. When a rhythm operation is completed, the data of the next position of the wafer is obtained by the machine vision inspection, and the data is transmitted to the wafer tray motor, so that the motor moves the next wafer to the aiming wafer position after the corresponding interval is completed. The same process is followed for the dispensing and bonding position of the PCB board, until all the dispensing positions on the PCB board are bonded to the chip, and then the PCB board is removed from the workbench by the transfer mechanism, and a new PCB board is installed first. things turn around.
3. System appearance
The motion control system of the die-bonding machine system generally adopts the scheme of connecting the motion control card based on the PCI bus to the industrial computer. The dynamic grasping and other module systems are connected, and the fully automatic high-speed die bonding function of automatic LED die bonding control based on machine vision is realized. , Action timing cooperation, high-precision, high-speed power control.
The motion control of the LED die bonder system is partially completed by servo motors and stepper motors. The motion of each motor is controlled by an industry-specific computer and motion control card. The industry-specific computer is the core part of the LED die bonder control system. , It is mainly responsible for the human-computer interaction interface management and control system to monitor the work in time, publish action instructions, and collect the information transmitted by the effective processing control card, so that each joint can complete the expected action, and ensure the machine position accuracy inspection and operation safety.
Under the control of the industry-specific computer in the Windows field, the LED die bonder system can fully utilize the hardware resources, greatly accelerate the data processing speed, improve the system operation efficiency, and adopts the visual user interface method, which is friendly to the human-machine interface.
4. List of famous products
Main control building: YONGS EPE complete machine IPC-820
The main board of the main control building is a high-performance area that uses Intel? H61 chipset, supports Intel? LGA1155 package dual-core, quad-core I3, I5, I7 and other series CPUs, supports two 800M/1066M/1333M DDR3 memory sticks, Large total capacity Support 16GB Onboard 2 10/100/1000Mbps web interface Support VGA+VGA, VGA+DVI dual performance function Support 4 SATA ports 10 USB 2.0 ports, 2 serial ports (one of which supports RS-232 /RS-422/RS-485), 1 parallel port and other rich I/O interfaces.
The whole machine case is a 4U 19" rack-mounted case. The case is made of 1.2 mm thick high-quality steel plate, sprayed with high-temperature baking paint, and has a solid structure. It has high heat dissipation, anti-vibration and anti-radiation performance. It can meet vibration For the application of strict working environment such as , electromagnetic interference, the CPU board and backplane of the main control building adopts the EVOC EPE bus scheme, and the CPCI pinhole continuum is continuously used between the CPU board and the backplane to complete.
5. Advantages of EVOC products
1. The whole machine system adopts EVOC EPE bus scheme, the CPU board and the bottom plate are connected with CPCI pinholes, 360-degree full-circle contact, with high air tightness, anti-corrosion, anti-oxidation, dust-proof, etc. In dusty, humid, high/low temperature, erosion and other industrial insidious environments, the contact surfaces of the sustainer are prone to clogging, oxidation or mildew, resulting in poor electrical contact, which completely eliminates all the bad performance of gold fingers in practical applications. , to ensure the reliability of the industrial computer work
2. Once the CPU board is placed in place, there will be no relative displacement between the contact surfaces of the male and female heads of the CPCI pinhole sustainer, no relative conflict, and no damage to the conductive layer, which improves the system's ability to resist vibration and impact, ensuring that the construction is in Requests for long-term dependable work in a vibrating environment
3. The unique CPU backplane bracket design transfers the heat dissipation value of the CPU to the metal chassis to avoid CPCI's unbalanced contact force between the processors, and at the same time, it is more stable between the two processors, and there will be no relative displacement. Further improve the ability of the whole machine to work reliably in a vibration environment
4. The EPE bus computer solves the problem that the computer field of the ancient gold finger industry cannot experience the power supply of the backplane, and becomes the chassis with complicated wiring. The EPE bus defines PS-ON#, 5V SBS (2A) and other lights, and the 12V power supply has 5 pins. Suffer 7A current, avoid the control connection between the bottom plate and the CPU board when using ATX power supply
5. The EPE bus system expansion interface gives priority to the high-speed control signal wiring in the light signal distribution, and the configuration of the ground light signal and the high-speed control light signal pins are adjacent to avoid the large distribution capacitance on the signal transmission line. Therefore, the completeness of the signal is strengthened, the EMC performance is strengthened, the reference and barrier function of the high-speed signal to the ground is strengthened, and the quality of the PCI and PCIE expansion signal is greatly improved, ensuring the reliability of the system.
6. The whole machine system adopts the "Intelligent System for Real-time Monitoring of Industrial Computer Operating Status" pioneered by EVOC, which can monitor the temperature of the joint devices of the system and the temperature of the operating environment in time, and can experience the computer technology to control the temperature status in time. The intelligent work of the cooling device, according to the different CPU temperature, the temperature control fan will have different speed adjustment corresponding to it. During this process, the operator can also check the changing CPU core temperature in time. Through this intelligent interactive system, It can effectively prevent the system from overheating. Even if a problem is found in the operation, it can know the problem location in an instant, and provide an effective operation guide for the operator to avoid the embarrassing field of "knowing what it is and not knowing what it is".
8. The whole system adopts oil-filled shock-absorbing pads to protect the hard disk, and between the hard-disk and its mounting bracket, the oil-filled shock-absorbing pad is used for soft continuity, which effectively avoids the hard collision between the hard disk and the bracket under external touch and impact force. Therefore, it can effectively protect the hard disk from being touched or damaged.
6. The conclusion
YONGS EPE bus products have the characteristics of long-term unimpeded consolidating work in a sinister industrial environment, and can very well meet the needs of hardware in harsh environments such as dusty, humid, high/low temperature, erosion, and vibration.
Over the years, EVOC has accumulated many experiences and successful cases in automation control, machine vision, and CNC machine tool design. EVOC will make unremitting efforts to provide customers with cost-effective products and technical clothing.
