1.Power line should be as short as possible, and line width should be as wide as possible.
2.The line should avoid sharp and right angles. Using 45 degree route.
3.Usually, the minimum line width and the minimum line distance are (> 4mil) and (> 4.5mil).
4.High frequency signal as short as possible, line as little as possible VIA, not allowed to cross cutting surface.
5.When the distance between two solder joints is very small, such as the pad adjacent to the patch device, the solder joints should not be directly connected.
6.The wiring and perforation of the whole circuit board should be uniform to avoid obvious uneven density. When there are large blank areas in the outer signal of PCB, auxiliary lines should be used to make the distribution of metal lines on the surface of PCB basically balanced.
7.Input and output signals should avoid adjacent parallel lines as far as possible. It is better to add ground lines between lines to prevent feedback coupling.
This article is reference only.
