Small-pitch LED display products (defined in the general market as a dot pitch not greater than 2.5mm) have opened up a new era of various command and dispatch centers due to stability, reliability, durability and easy maintenance, and continue to meet other mid-to-high-end application scenarios Refined and personalized product requirements. For these LED small-pitch screen suppliers, how to use reasonable LED semiconductor packaging to save material costs has always been a very critical detail, such as relying on mature and high-yield LED packaging processes. This article will take you to quickly understand the current mainstream LED packaging methods in the industry.
Small pitch led display
SMD: Open the era of indoor applications for LED small-pitch screens
Main application scenarios: traditional small-pitch screens for indoor commerce
Chip size: about> 500 microns
In recent years, with the maturity of the three-in-one surface-mount packaging technology (SMD), small-pitch LED displays have gradually penetrated the indoor application market. It has many advantages such as flexible combination of modules, large viewing angle, good color consistency, and good contrast. In addition, with its high degree of automation, mature technology, and high yield rate, the surface mount technology can be directly used in SMT high-speed placement machines. It has the advantages of easy installation and disassembly and easy maintenance process based on the cabinet.
With the upgrading of LED packaging technology, that is, the miniaturization of LED crystal particles in the packaging stage, the advantages of low cost and mass production will become more obvious, and two packaging devices, Mini-LED and Micro-LED, have been derived to be more sophisticated. The new packaging method.
Mini-LED: the main COB and four-in-one IMD
Main application scenarios: Backlight or RGB display applications in the high-end market to be packaged
Chip size: about 100~200 microns
Compared with the SMD package, Mini-LED has a smaller chip size, so it has higher requirements on the accuracy of the cutting link, the consistency of the wavelength, and the uniformity of the thickness. At present, its packaging methods mainly include COB (Chip on Board) and four-in-one IMD.
COB (Chip on Board) technology: The LED chip is directly packaged on the module substrate, and then each large unit is integrally molded. It is integrated and packaged and then mounted, eliminating the cost of a single LED device. The power is low, the heat dissipation effect is good, the color display is more uniform, and the resolution is more high-definition, so it is easier to achieve a smaller pitch and unlimited screen display. Show scheme. However, its yield rate is not high due to technical problems such as the industrial chain, chip end, and packaging end.
Four-in-one IMD (Integrated Mounted Devices) package: This package method combines the advantages of traditional surface mount and COB, and can also be regarded as a small COB unit that uses surface mount (SMD) technology, that is, four sets of RGB lights The beads are encapsulated in a small unit. The technical difficulties it faces are similar to the above-mentioned COB packaging technology, but the process difficulty is reduced. With the continuous improvement of chip requirements, the industry may launch an "N-in-one" solution (N>4) in the future.
Micro-LED: Show the ultimate direction
Main application scenarios: unknown
Chip size: <50 microns
As a next-generation conceptual display solution, it is also the ultimate direction of display. Micro-LED chips use inorganic materials to further reduce the size, with pixelation and no substrate as the main concept. Compared with OLED panels using organic materials and organic materials, it has almost no light consumption and has significant advantages in terms of life and stability. At present, both Sony and Samsung in the industry have relatively mature applications for it.
Compared with the traditional scheme, the display scheme using high-quality LED chip package maintains stable electrical performance on the one hand, reduces the probability of corrosion of the fluid to the chip, and on the other hand, it is convenient for transportation and saves material costs, can be recycled, and is economical. The sex is very impressive.
Various LED small-pitch screen solutions built at any cost, with the continuous advancement of LED packaging technology, the future mass-produced and more economical LED display screens may gradually replace the stock market of traditional splicing walls in the middle and high-end control field. .
